Leadless leadframe package substitute and stack package

Details Leadless leadframe package substitute and stack package Leadless leadframe package substitute and stack package

2004-07-08

2008-10-07

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S777000

Reexamination Certificate

active

07432583

ABSTRACT:
A semiconductor package is provided with an internal package formed in the cavity of the external leadless leadframe package (LLP). The internal package is a leadless leadframe package and provides a substrate for mounting one or more die and passive devices to form the external LLP. By arranging the die and passive components on the internal package, higher chip density and a smaller form factor may be achieved.

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U.S. Appl. No. 09/658,166, filed Sep. 8, 2000.

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