Leadless integrated circuit package having electrically...

Details Leadless integrated circuit package having electrically... Leadless integrated circuit package having electrically...

2009-06-05

2011-12-06

Williams, A O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23031, C257SE21506, C257S692000, C257S684000, C257S686000, C257S698000, C257S796000, C257S712000, C257S713000, C257S717000, C257S720000, C257S675000

Reexamination Certificate

active

08072053

ABSTRACT:
A leadless integrated circuit (IC) package comprising an IC chip mounted on a metal leadframe and a plurality of electrical contacts electrically coupled to the IC chip. The IC chip, the electrical contacts, and a portion of the metal leadframe are covered with an encapsulation compound, with portions of the electrical contacts exposed on a bottom surface of the encapsulation compound. The electrical contacts of the IC package having metal traces connecting bonding areas on a top surface thereof and contact areas on a bottom surface thereof, wherein at least some of the bonding areas are laterally disposed from the contact areas connected thereto.

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