Leadless leadframe implemented in a leadframe-based BGA package

Details Leadless leadframe implemented in a leadframe-based BGA package Leadless leadframe implemented in a leadframe-based BGA package

2006-10-13

2009-08-25

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S692000, C257S782000, C257S783000, C257S784000, C257S786000, C257SE23043, C257SE23046

Reexamination Certificate

active

07579676

ABSTRACT:
A leadless leadframe has a plurality of bottom leads and a plurality of top soldering pads formed in different layers. After encapsulation and before solder ball placement, a half-etching process is performed to remove the bottom leads to make the top soldering pads electrically isolated, exposed and embedded in the encapsulant for solder ball placement where the soldering area of the top soldering pads is defined without the need of solder mask(s) to solve the diffusion of solder balls on the leads during reflow.

REFERENCES:
patent: 6204553 (2001-03-01), Liu et al.
patent: 6451627 (2002-09-01), Coffman
patent: 6462422 (2002-10-01), Huang
patent: 6703700 (2004-03-01), Hsu et al.
patent: 6933594 (2005-08-01), McLellan et al.
patent: 6984878 (2006-01-01), Park et al.
patent: 2003/0071332 (2003-04-01), Hsu et al.
patent: 529770 (2003-04-01), None
patent: 567566 (2003-12-01), None
patent: 584316 (2004-04-01), None

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