Leadframes for high adhesion semiconductor devices and...

Details Leadframes for high adhesion semiconductor devices and... Leadframes for high adhesion semiconductor devices and...

2005-10-11

2005-10-11

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S677000

Reexamination Certificate

active

06953986

ABSTRACT:
A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.

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