Leadless type semiconductor package, and production process...

Details Leadless type semiconductor package, and production process... Leadless type semiconductor package, and production process...

2007-05-29

2007-05-29

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S778000

Reexamination Certificate

active

10869949

ABSTRACT:
A leadless type semiconductor package includes a plate-like mount, and at least one semiconductor chip mounted on the plate-like mount such that a bottom surface of the semiconductor chip is secured to the plate-like mount, and the semiconductor chip has at least one electrode pad formed on a top surface thereof. The package further includes at least one flat electrode electrically connected to the electrode pad, and a molded resin enveloper for completely sealing and encapsulating the semiconductor chip. The molded resin enveloper further partially seals and encapsulates the flat electrode such that a part of the flat electrode is exposed as an outer electrode pad on a top surface of the molded resin enveloper.

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