Leadless leadframe with an improved die pad for mold locking

Details Leadless leadframe with an improved die pad for mold locking Leadless leadframe with an improved die pad for mold locking

2006-01-10

2006-01-10

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

C257S666000, C257S674000, C257S787000

Reexamination Certificate

active

06984878

ABSTRACT:
A leadless leadframe with an improved die pad for mold locking includes a die pad and a plurality of leads. The leads are arranged around the die pad. A plurality of indentations, such as side semi-vias, are formed on the sidewall of the die pad for filling a package body of the semiconductor package so as to enhance the horizontal mold locking capability of the die pad.

REFERENCES:
patent: 5532905 (1996-07-01), Moore
patent: 6143981 (2000-11-01), Glenn
patent: 6197615 (2001-03-01), Song et al.
patent: 6525406 (2003-02-01), Chung et al.
patent: 6750545 (2004-06-01), Lee et al.
patent: 6838751 (2005-01-01), Cheng et al.
patent: 2001/0006250 (2001-07-01), Kang et al.
patent: 1 235 272 (2002-01-01), None
patent: 531053 (2003-05-01), None

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