Leadless semiconductor device and method for making the same

Details Leadless semiconductor device and method for making the same Leadless semiconductor device and method for making the same

1992-04-10

1992-12-15

Wojciechowicz, Edward J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

437211, 437220, 437902, 257693, 257796, 257737, H01L 2328, H01L 2156

Patent

active

051722143

ABSTRACT:
A semiconductor device having a thin package profile is leadless, thereby minimizing necessary mounting space on a substrate. In one form, a semiconductor device has a semiconductor die electrically coupled to a plurality of conductive leads. Each lead has a first portion, a second portion, and an intermediate portion which separates the first and second portions. A package body encapsulates the semiconductor die and the first and intermediate portions of the leads. The second portions of the leads are exposed on the bottom surface of the package body and are used to electrically access the semiconductor die.

REFERENCES:
patent: 4866506 (1989-09-01), Nambu et al.
patent: 4890152 (1989-12-01), Hirata et al.
patent: 4945398 (1990-07-01), Kurita et al.
patent: 4992850 (1991-02-01), Corbett et al.
patent: 5122860 (1992-06-01), Kikuchi et al.

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