Leadless plastic chip carrier with etch back pad singulation

Details Leadless plastic chip carrier with etch back pad singulation Leadless plastic chip carrier with etch back pad singulation

2005-08-23

2005-08-23

Tran, Minh-Loan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S691000, C257S692000, C257S786000

Reexamination Certificate

active

06933594

ABSTRACT:
A leadless plastic chip carrier is constructed by half etching one or both sides of the package design onto a leadframe strip so as to create unique design features such as power and/or ground ring surrounding the die attach pad, interlocking rivet head construction for the contact pads, and an interlocking pattern for the die attach pad. After wire bonding and molding, a further etching is performed to isolate and expose contact pads. Singulation of individual chip packages from the leadframe strip is then performed by saw singulation or die punching.

REFERENCES:
patent: 4530152 (1985-07-01), Roche et al.
patent: 4685998 (1987-08-01), Quinn et al.
patent: 5066831 (1991-11-01), Spielberger et al.
patent: 5293072 (1994-03-01), Tsuji et al.
patent: 5444301 (1995-08-01), Song et al.
patent: 5457340 (1995-10-01), Templeton, Jr. et al.
patent: 5710695 (1998-01-01), Manteghi
patent: 5777382 (1998-07-01), Abbott et al.
patent: 5900676 (1999-05-01), Kweon et al.
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 6001671 (1999-12-01), Fjelstad
patent: 6057601 (2000-05-01), Lau et al.
patent: 6081029 (2000-06-01), Yamaguchi
patent: 6093584 (2000-07-01), Fjelstad
patent: 6194786 (2001-02-01), Orcutt
patent: 6229200 (2001-05-01), Mclellan et al.
patent: 6238952 (2001-05-01), Lin
patent: 6294830 (2001-09-01), Fjelstad
patent: 6306685 (2001-10-01), Liu et al.
patent: 6459163 (2002-10-01), Bai
patent: 6498099 (2002-12-01), McLellan et al.
patent: 6528877 (2003-03-01), Ernst et al.
patent: 6545347 (2003-04-01), McClellan
patent: 6585905 (2003-07-01), Fan et al.
patent: 6586677 (2003-07-01), Glenn
patent: 6635957 (2003-10-01), Kwan et al.
patent: 6821821 (2004-11-01), Fjelstad
patent: 2003/0015780 (2003-01-01), Kang et al.
patent: 59-208756 (1984-11-01), None
patent: SHO 59-208756 (1984-11-01), None

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