Leadless leadframe packaging panel featuring peripheral...

Details Leadless leadframe packaging panel featuring peripheral... Leadless leadframe packaging panel featuring peripheral...

2006-02-21

2006-02-21

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257S669000, C257S670000, C257S674000, C438S111000, C438S110000, C438S123000

Reexamination Certificate

active

07002239

ABSTRACT:
Methods and apparatuses for providing leadless leadframes with dummy contact leads are disclosed. A leadframe is described that includes an enclosed frame having two lengthwise portions and two widthwise portions. The leadframe also includes a device area array with dummy contact leads formed on the peripheral edges of the device area array. Furthermore, dummy contact leads are positioned along a tie bar such that they are directly opposite corresponding contact leads. By cutting along the tie bar, dummy contact leads are separated from the device area array.

REFERENCES:
patent: 5424577 (1995-06-01), Suzuki et al.
patent: 6229200 (2001-05-01), Mclellan et al.
patent: 6281568 (2001-08-01), Glenn et al.
patent: 6400004 (2002-06-01), Fan et al.

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