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Flashless lead frame with horizontal singulation

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Flat chip semiconductor device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Flat leadframe for a semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Flat leadless packages and stacked leadless package assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Flat package for semiconductor diodes

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Flat package for semiconductor IC

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Flat semiconductor package with half package molding

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Flex clip connector for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Flexible core for enhancement of package interconnect...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Flexible interconnect substrate of a tape-shaped...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Flexible interconnecting substrate, film, carrier,...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Flexible printed circuit substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Flexible semiconductor device with groove(s) on rear side of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With means for controlling lead tension
Reexamination Certificate

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Flexible substrate for package of die

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Flexible tab semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Flip chip in leaded molded package and method of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Flip chip in leaded molded package and method of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Flip chip in leaded molded package and method of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Flip chip in leaded molded package with two dies

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Flip chip metal bonding to plastic leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper
Reexamination Certificate

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