Flexible substrate for package of die

Details Flexible substrate for package of die Flexible substrate for package of die

2005-12-22

2008-10-28

Pizarro, Marcos D. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

C257S666000, C257S677000, C257S672000, C257S782000, C257S668000, C257SE23031, C257SE23059, C257SE23043, C257SE23004, C257SE23050

Reexamination Certificate

active

07443013

ABSTRACT:
The present invention provides a flexible substrate for a package of a die which has an active surface and a plurality of first bond pads arranged in a form of a row and formed on the active surface. The flexible substrate includes a flexible insulating film and a plurality of first leads formed on the flexible insulating film. Each of the first leads corresponds to one of the first bond pads and has a respective first body portion, a respective first bond portion and a respective first extension portion. For each of the first leads, the width of the first bond portion is larger than those of the first body portion and the first extension portion.

REFERENCES:
patent: 5016082 (1991-05-01), Roth
patent: 6107675 (2000-08-01), Sugimoto et al.
patent: 6124547 (2000-09-01), Fujimori
patent: 6342727 (2002-01-01), Fujimori
patent: 6451626 (2002-09-01), Lin
patent: 6566763 (2003-05-01), Shiozawa
patent: 7061078 (2006-06-01), Cheng
patent: 2001/0054751 (2001-12-01), Toyosawa

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