Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2008-08-27
2010-11-30
Potter, Roy K (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S666000, C257SE23037
Reexamination Certificate
active
07843046
ABSTRACT:
A flat leadless package includes at least one die mounted onto a leadframe and electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, an assembly includes stacked leadless packages electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, a package module includes an assembly of stacked leadless packages mounted on a support and electrically connected to circuitry in the support using an electrically conductive polymer or an electrically conductive ink.
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International Search Report, mailed Aug. 26, 2009, PCT Application No. US/2009/034368.
Andrews, Jr. Lawrence Douglas
Leal Jeffrey
McElrea Simon J. S.
Haynes Beffel & Wolfeld LLP
Kennedy Bill
Potter Roy K
Vertical Circuits, Inc.
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