Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2000-06-19
2001-10-09
Flynn, Nathan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S099000, C257S433000, C257S735000, C438S124000
Reexamination Certificate
active
06300674
ABSTRACT:
BACKGROUND OF THE INVENTION
(1) Field of the Invention
This invention relates to semiconductor diode package, in particular to optical diodes.
(2) Brief Description of the Related Art
FIG. 1
shows a conventional dual-inline package for semiconductor diodes such as that used for light emitting diodes (LED), laser diodes (LD), photo-diodes (PD) etc. Such packages are also applicable to image sensors. The diode chip
10
has a bottom electrode
12
and a top electrode
14
. These electrodes are coupled to the extensions of two pins
13
and
15
for external connections. The bottom electrode
12
is coupled to pin
13
and the top electrode
15
is coupled through a bonding wire to pin
15
. T
he trend today is to miniaturize the package size of a semiconductor device. The extensions of pins
13
and
15
occupy space of the package.
SUMMARY OF THE INVENTION
An object of this package is to miniaturize the dimensions of a diode package. Another object of this invention is to facilitate surface mounting the package. These objects are obtained by surface mounting a diode package as a flat package. The bottom of the flat package has two pads, which form the external connections for the diode. The bottom electrode is mounted on one of the pads and the top electrode of the diode is wire bonded to the other pad. Thus no extensions of the connection pins are used and space is saved. The package is sealed in a transparent protective glue for an optical device.
REFERENCES:
patent: 5444301 (1995-08-01), Song et al.
patent: 5969416 (1999-10-01), Kim
patent: 6114750 (2000-09-01), Udagawa et al.
patent: 6130115 (2000-10-01), Okumura et al.
patent: 59208756-A (1984-11-01), None
patent: 2000349222-A (2000-12-01), None
Flynn Nathan
Forde Remmon R.
H.C. Lin Patent Agent
Harvatek Corp.
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