Flat leadframe for a semiconductor package

Details Flat leadframe for a semiconductor package Flat leadframe for a semiconductor package

2005-04-26

2005-04-26

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S787000, C257S676000

Reexamination Certificate

active

06885088

ABSTRACT:
The leadframe has a perforation to form, between a central platform and a peripheral part located a certain distance apart, radiating elongate leads. The leadframe has, on its rear face that comes into contact with a bearing surface of a mold, at least one recess and a groove for connecting this recess to the perforation.

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