Flat leadframe for a semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Details

C257S787000, C257S676000

Reexamination Certificate

active

06885088

ABSTRACT:
The leadframe has a perforation to form, between a central platform and a peripheral part located a certain distance apart, radiating elongate leads. The leadframe has, on its rear face that comes into contact with a bearing surface of a mold, at least one recess and a groove for connecting this recess to the perforation.

REFERENCES:
patent: 5639694 (1997-06-01), Diffenderfer et al.
patent: 6627976 (2003-09-01), Chung et al.
patent: 6667439 (2003-12-01), Salatino et al.
patent: 1032037 (2000-08-01), None
patent: 61097955 (1986-05-01), None
patent: 62098751 (1987-10-01), None
patent: 63115355 (1988-05-01), None
patent: 63228655 (1988-09-01), None
patent: 2001077273 (1988-09-01), None
patent: 01065861 (1989-03-01), None
patent: 05095077 (1993-04-01), None
patent: 06069401 (1994-03-01), None
patent: 2000003986 (2000-01-01), None

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