Flip chip in leaded molded package and method of manufacture...

Details Flip chip in leaded molded package and method of manufacture... Flip chip in leaded molded package and method of manufacture...

2006-12-26

2006-12-26

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S502000, C257S578000, C257S666000, C257S782000, C257S787000, C257SE23031, C257SE23069

Reexamination Certificate

active

07154168

ABSTRACT:
A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when it is coupled to the leadframe. Leads on the leadframe are coupled to source and gate terminals on the die while the metallized backside of the die serves as the drain terminals.

REFERENCES:
patent: 5105536 (1992-04-01), Neugebauer et al.
patent: 5250841 (1993-10-01), Sloan et al.
patent: 5319242 (1994-06-01), Carney et al.
patent: 5554569 (1996-09-01), Ganesan et al.
patent: 5637916 (1997-06-01), Joshi
patent: 5765280 (1998-06-01), Joshi
patent: 5789809 (1998-08-01), Joshi
patent: 5811879 (1998-09-01), Akram
patent: 6133634 (2000-10-01), Joshi
patent: 6198163 (2001-03-01), Crowley et al.
patent: 6215176 (2001-04-01), Huang
patent: 6249041 (2001-06-01), Kasem et al.
patent: 6294403 (2001-09-01), Joshi
patent: 6307755 (2001-10-01), Williams et al.
patent: 6319755 (2001-11-01), Mauri
patent: 6384492 (2002-05-01), Iversen et al.
patent: 6388336 (2002-05-01), Venkateshwaran et al.
patent: 6399418 (2002-06-01), Glenn et al.
patent: 6423623 (2002-07-01), Bencuya et al.
patent: 6448110 (2002-09-01), Chen et al.
patent: 6452278 (2002-09-01), DiCaprio et al.
patent: 6469384 (2002-10-01), Joshi
patent: 6489678 (2002-12-01), Joshi
patent: 6528880 (2003-03-01), Planey
patent: 6566749 (2003-05-01), Joshi et al.
patent: 6627991 (2003-09-01), Joshi
patent: 6633030 (2003-10-01), Joshi
patent: 6661082 (2003-12-01), Granada et al.
patent: 6683375 (2004-01-01), Joshi et al.
patent: 6696321 (2004-02-01), Joshi
patent: 6720642 (2004-04-01), Joshi et al.
patent: 6731003 (2004-05-01), Joshi et al.
patent: 6744124 (2004-06-01), Chang et al.
patent: 2003/0025183 (2003-02-01), Thornton et al.
patent: 2004/0056364 (2004-03-01), Joshi et al.
patent: 2005/0280126 (2005-12-01), Joshi
patent: 1-134958 (1989-05-01), None
“IR'S New Synchronous Rectifier Chip Set Meets New Efficiency Standard for DC—DC Converters to Power Notebook PC Processors through 2000.” International Rectifier Company Information. Retrieved from the World Wide Web on Sep. 9, 2003 at http://www.irf.com/whats-new
r990402.html.

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