Flashless lead frame with horizontal singulation

Details Flashless lead frame with horizontal singulation Flashless lead frame with horizontal singulation

2006-12-26

2006-12-26

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

C257S666000, C257S669000

Reexamination Certificate

active

07154165

ABSTRACT:
A lead frame is configured for use with a singulation apparatus that eliminates flash. A die pad is attached to sides of the frame by tie bars and peripheral portions. The peripheral portions have cutout sections defining openings that are bridged by lead frame segments. The apparatus applies a downward force to the lead frame segments and translates the downward force to a horizontal force applied to the tie bars. The singulation process confines movement of the lead frame metal to within the plane of the lead frame.

REFERENCES:
patent: 6251568 (2001-06-01), Hsia et al.
patent: 6281568 (2001-08-01), Glenn et al.
patent: 6894370 (2005-05-01), Kiyohara

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