Flat chip semiconductor device and manufacturing method thereof

Details Flat chip semiconductor device and manufacturing method thereof Flat chip semiconductor device and manufacturing method thereof

2007-05-22

2007-05-22

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S738000, C257S778000, C257S779000, C257SE23020, C257SE23021, C257SE23023

Reexamination Certificate

active

11133613

ABSTRACT:
A flip chip semiconductor device having an improved structure and a method of manufacturing the flip chip semiconductor device, in which a semiconductor chip can be more securely joined to a lead frame while preventing contact defects between the two. The flip chip semiconductor device includes: a semiconductor chip having electrode pads formed on one side; conductive bumps formed on the electrode pads of the semiconductor chip; and a lead frame including a plurality of leads, the ends of which are electrically connected to the conductive bumps, wherein each of the leads has at least one groove formed thereon, and a solder plating layer is provided on the leads in and about the groove and melted to secure the connection with the conductive bumps.

REFERENCES:
patent: 6388336 (2002-05-01), Venkateshwaran et al.
patent: 6621152 (2003-09-01), Choi et al.
patent: 6750551 (2004-06-01), Frutschy et al.
Charles A. Harper, Electronic Packaging and Interconnection Handbook, 2000, The Mcgraw-Hill companies, Inc., Third Edition, p. 6.1.

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