Flex clip connector for semiconductor device

Details Flex clip connector for semiconductor device Flex clip connector for semiconductor device

2008-01-10

2009-12-01

Ha, Nathan W (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257SE23039

Reexamination Certificate

active

07626249

ABSTRACT:
A semiconductor die package. The semiconductor die package includes a semiconductor die having a first surface comprising a die contact region, and a second surface. It also includes a leadframe structure having a die attach pad and a lead structure, where the semiconductor die is attached to the die attach pad. It also includes a flex clip connector comprising a flexible insulator, a first electrical contact region, and a second electrical contact region. The first electrical contact region of the flex clip connector is coupled to the die contact region and the second electrical contact region of the flex clip connector is coupled to the lead structure.

REFERENCES:
patent: 3956821 (1976-05-01), Martin
patent: 4058899 (1977-11-01), Phy
patent: 4191943 (1980-03-01), Cairns et al.
patent: 4680613 (1987-07-01), Daniels et al.
patent: 4720396 (1988-01-01), Wood
patent: 4731701 (1988-03-01), Kuo et al.
patent: 4751199 (1988-06-01), Phy
patent: 4772935 (1988-09-01), Lawler et al.
patent: 4791493 (1988-12-01), Ogura et al.
patent: 4796080 (1989-01-01), Phy
patent: 4839717 (1989-06-01), Phy et al.
patent: 4890153 (1989-12-01), Wu
patent: 5327325 (1994-07-01), Nicewarner, Jr.
patent: 5646446 (1997-07-01), Nicewarner, Jr. et al.
patent: 5776797 (1998-07-01), Nicewarner, Jr. et al.
patent: 6133634 (2000-10-01), Joshi
patent: 6329706 (2001-12-01), Nam
patent: 6424035 (2002-07-01), Sapp et al.
patent: 6432750 (2002-08-01), Jeon et al.
patent: 6449174 (2002-09-01), Elbanhawy
patent: 6465276 (2002-10-01), Kuo
patent: 6489678 (2002-12-01), Joshi
patent: 6556750 (2003-04-01), Constantino et al.
patent: 6566750 (2003-05-01), Sofue et al.
patent: 6574107 (2003-06-01), Jeon et al.
patent: 6621152 (2003-09-01), Choi et al.
patent: 6627991 (2003-09-01), Joshi
patent: 6630726 (2003-10-01), Crowley et al.
patent: 6645791 (2003-11-01), Noquil et al.
patent: 6674157 (2004-01-01), Lang
patent: 6683375 (2004-01-01), Joshi et al.
patent: 6696321 (2004-02-01), Joshi
patent: 6720642 (2004-04-01), Joshi et al.
patent: 6731003 (2004-05-01), Joshi et al.
patent: 6740541 (2004-05-01), Rajeev
patent: 6756689 (2004-06-01), Nam et al.
patent: 6774465 (2004-08-01), Lee et al.
patent: 6777800 (2004-08-01), Madrid et al.
patent: 6806580 (2004-10-01), Joshi et al.
patent: 6830959 (2004-12-01), Estcio
patent: 6836023 (2004-12-01), Joshi et al.
patent: 6867481 (2005-03-01), Joshi et al.
patent: 6867489 (2005-03-01), Estacio
patent: 6891256 (2005-05-01), Joshi et al.
patent: 6891257 (2005-05-01), Chong et al.
patent: 6893901 (2005-05-01), Madrid
patent: 6943434 (2005-09-01), Tangpuz et al.
patent: 6989588 (2006-01-01), Quinones et al.
patent: 6992384 (2006-01-01), Joshi
patent: 7022548 (2006-04-01), Joshi et al.
patent: 7023077 (2006-04-01), Madrid
patent: 7061077 (2006-06-01), Joshi
patent: 7061080 (2006-06-01), Jeun et al.
patent: 7081666 (2006-07-01), Joshi et al.
patent: 7122884 (2006-10-01), Cabahug et al.
patent: 7154168 (2006-12-01), Joshi et al.
patent: 7157799 (2007-01-01), Noquil et al.
patent: 7196313 (2007-03-01), Quinones et al.
patent: 7199461 (2007-04-01), Son et al.
patent: 7208819 (2007-04-01), Jeun et al.
patent: 7215011 (2007-05-01), Joshi et al.
patent: 7217594 (2007-05-01), Manatad
patent: 7242076 (2007-07-01), Dolan
patent: 7256479 (2007-08-01), Noquil et al.
patent: 7268414 (2007-09-01), Choi et al.
patent: 7271497 (2007-09-01), Joshi et al.
patent: 7285849 (2007-10-01), Cruz et al.
patent: 7315077 (2008-01-01), Choi et al.
patent: 7332806 (2008-02-01), Joshi et al.
patent: 2006/0214222 (2006-09-01), Challa et al.
patent: 2008/0048342 (2008-02-01), Cheah et al.
patent: 2008/0224300 (2008-09-01), Otremba
U.S. Appl. No. 11/626,503, Cruz et al.

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