Flat package for semiconductor IC

Details Flat package for semiconductor IC Flat package for semiconductor IC

1995-08-16

1997-04-01

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257691, 257698, 257703, 257700, H01L 23495, H01L 2352, H01L 2304

Patent

active

056169540

ABSTRACT:
In a flat package for a semiconductor IC (Integrated Circuit), a substrate has internal ground wirings respectively connecting a cavity and a seal metallized portion to respective suspension leads. The suspension leads are connected to ground for a shielding purpose. With this configuration, the package eliminates the need for exclusive ground leads which would limit the number of available valid leads. In addition, a single standard type of ICs can implement various shield configurations as desired by users.

REFERENCES:
patent: 4972253 (1990-11-01), Palino et al.
patent: 5168344 (1992-12-01), Ehlert et al.
patent: 5315486 (1994-05-01), Fillion et al.
patent: 5394303 (1995-02-01), Yamaji
LSI Handbook, Institute of Electronic and Communication Engineers of Japan, published by Ohm Sha, 1984, pp. 414-415.

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