Flexible printed circuit substrate

Details Flexible printed circuit substrate Flexible printed circuit substrate

2005-02-22

2005-02-22

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

C257S775000

Reexamination Certificate

active

06858921

ABSTRACT:
A novel flexible printed circuit substrate can be processed into a flexible printed circuit board having a high-accuracy connecting part which does not cause a connection failure when it is connected to a connector even if a pitch between two adjacent terminals is further reduced. The flexible printed circuit substrate has dummy patterns which are formed, simultaneously with the terminals, on the sides of the connecting part, in a shape corresponding to the outline of both sides of connecting part which are used for positioning the terminals when the connecting part is attached to the connector. The dummy patterns are used as masks when a base film is subjected to a laser process.

REFERENCES:
patent: 4972580 (1990-11-01), Nakamura
patent: 6319019 (2001-11-01), Kwon et al.
patent: 2662477 (1997-06-01), None

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