Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate
2007-05-08
2007-05-08
Andujar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With bumps on ends of lead fingers to connect to semiconductor
C257S666000, C257S737000, C257S779000, C257S780000
Reexamination Certificate
active
11213182
ABSTRACT:
A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when it is coupled to the leadframe. Leads on the leadframe are coupled to source and gate terminals on the die while the metallized backside of the die serves as the drain terminals.
REFERENCES:
patent: 4678358 (1987-07-01), Layher
patent: 5105536 (1992-04-01), Neugebauer et al.
patent: 5147821 (1992-09-01), McShane et al.
patent: 5250841 (1993-10-01), Sloan et al.
patent: 5319242 (1994-06-01), Carney et al.
patent: 5347709 (1994-09-01), Maejima et al.
patent: 5554569 (1996-09-01), Ganesan et al.
patent: 5654206 (1997-08-01), Merrill
patent: 5723900 (1998-03-01), Kojima et al.
patent: 5811879 (1998-09-01), Akram
patent: 6018686 (2000-01-01), Orso et al.
patent: 6198163 (2001-03-01), Crowley et al.
patent: 6214640 (2001-04-01), Fosberry et al.
patent: 6215176 (2001-04-01), Huang
patent: 6249041 (2001-06-01), Kasem
patent: 6307755 (2001-10-01), Williams et al.
patent: 6319755 (2001-11-01), Mauri
patent: 6384492 (2002-05-01), Iversen et al.
patent: 6388336 (2002-05-01), Venkateshwaran et al.
patent: 6399418 (2002-06-01), Glenn et al.
patent: 6423623 (2002-07-01), Bencuya
patent: 6429509 (2002-08-01), Hsuan
patent: 6448110 (2002-09-01), Chen et al.
patent: 6452278 (2002-09-01), DiCaprio et al.
patent: 6528880 (2003-03-01), Planey
patent: 6744124 (2004-06-01), Chang
patent: 6989588 (2006-01-01), Quinones et al.
patent: 2003/0025183 (2003-02-01), Thornton et al.
patent: 2004/0201086 (2004-10-01), Joshi
patent: 2005/0167848 (2005-08-01), Joshi
patent: 2006/0151861 (2006-07-01), Noquil et al.
patent: 2006/0220241 (2006-10-01), Thornton et al.
patent: 1-134958 (1989-05-01), None
“IR'S New Synchronous Rectifier Chip Set Meets New Efficiency Standard for DC-DC Converters to Power Notebook PC Processors through 2000.” International Rectifier Company Information. Retrieved from the World Wide Web on Sep. 9, 2003 at http://www.irf.com/whats-new
r990402.html.
Joshi Rajeev
Manatad Romel N.
Tangpuz Consuelo N.
Andujar Leonardo
Fairchild Semiconductor Corporation
Soderholm Krista
Townsend and Townsend / and Crew LLP
LandOfFree
Flip chip in leaded molded package and method of manufacture... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Flip chip in leaded molded package and method of manufacture..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip chip in leaded molded package and method of manufacture... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3806573