LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Transistor package with integral heatsink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Transponder incorporated into an electronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Transport speed monitoring apparatus and semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Transportable object and process of production

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tray for ball grid array semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Triazine thin film adhesives

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Tunable semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Two part mold for wafer scale caps

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Two piece heat sink and device package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Two-sided wafer escape package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Two-stage transfer molding device to encapsulate MMC module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Two-stage transfer molding device to encapsulate MMC module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Two-stage transfer molding method to encapsulate MMC module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Two-wavelength semiconductor laser diode package for use on...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

UFBGA package equipped with interface assembly including a photo

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Ultra high density integrated circuit packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Ultra high density integrated circuit packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Ultra high density integrated circuit semiconductor package...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Ultra slim semiconductor package and method of fabricating...