Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-03-08
2005-03-08
Thomas, Tom (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S719000, C257S722000, C257S726000, C257S727000, C257S732000, C361S730000, C361S732000, C361S759000, C361S801000, C361S802000, C361S831000
Reexamination Certificate
active
06864573
ABSTRACT:
A two piece electronic component heat sink and device package comprising a first piece configured to retain electronic components, and a second piece having a hinge region configured to moveably connect the second piece to the first piece, and a snap lock region opposite the hinge region, the snap lock region configured to secure the second piece to the first piece. A two piece electronic component heat sink and device package for a circuit board comprising: a first piece having an index slot for retaining said circuit board, and a second piece having a hinge region configured to pivotably connect the second piece and the first piece, and a snap lock region configured to secure the second piece to the first piece.
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Brown Gary L
Robertson Michael F
DaimlerChrysler Corporation
Smith Ralph E.
Thomas Tom
Warren Matthew E.
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