Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent
1997-09-22
2000-04-11
Picardat, Kevin M.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
257712, 257723, H01L 2302
Patent
active
06049123&
ABSTRACT:
Thin and durable level-one and level-two integrated circuit packages are provided. A thin and durable level-one package is achieved in one method involving a molding technique of evenly applying molding compound to an integrated circuit die element. The casing surrounding a die element may be reduced or eliminated in part to thin the level-one package provided any necessary steps are taken to ensure the integrity of the package. Moisture-barriers, as an example, may be provided to the upper and/or lower surfaces of the thin level-one package. Additionally, a thin level-one package may also be constructed with one or more metal layers to prevent warpage. These level-one packages may be aligned in a stacked configuration to form a thin and durable horizontal level-two package. Various thermal conductors may be thermally coupled to the level-two package to help dissipate heat.
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Picardat Kevin M.
Staktek Corporation
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