Two-stage transfer molding device to encapsulate MMC module

Details Two-stage transfer molding device to encapsulate MMC module Two-stage transfer molding device to encapsulate MMC module

2007-10-09

2007-10-09

Zarneke, David A. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

C257S687000, C257S787000, C257S790000, C257S793000, C257SE21502

Reexamination Certificate

active

10791192

ABSTRACT:
A semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparatus by removable insertion therein. The substrate is defined by a peripheral opening in a surrounding frame, which may be part of a multiframe strip. The substrate is connected to the frame by connecting segments. The card includes a first plastic casting molded to the substrate and encapsulating the semiconductor components while leaving a peripheral portion of the substrate uncovered. A second plastic casting is molded to the peripheral portion to abut the first plastic casting and form the card periphery. A method for fabricating the semiconductor card is also included.

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