Transistor package with integral heatsink

Details Transistor package with integral heatsink Transistor package with integral heatsink

1996-07-11

1998-02-17

Whitehead, Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257706, H01L 2310, H01L 2334

Patent

active

057194416

ABSTRACT:
A metallic heatsink consisting of material having high thermal conductivity includes plural regions of finstock which underlie a ceramic window type frame enclosing at least one heat spreading insulator member on which is located at least one silicon carbide semiconductor chip including a plurality of silicon carbide transistors. On both sides of the chip are impedance transformation elements connecting bondwires to input and output leads extending through the ceramic window frame for connection of the chip to external circuitry.

REFERENCES:
patent: 4256792 (1981-03-01), Koepke et al.
patent: 4765400 (1988-08-01), Chu et al.
patent: 4879632 (1989-11-01), Yamamoto et al.
patent: 5041902 (1991-08-01), McShane
patent: 5483102 (1996-01-01), Neal et al.

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