Two part mold for wafer scale caps

Details Two part mold for wafer scale caps Two part mold for wafer scale caps

2006-10-24

2006-10-24

Whitehead, Jr., Carl (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S666000, C438S015000, C438S025000, C438S026000, C438S051000, C438S055000, C438S064000, C438S106000, C438S112000, C438S124000, C438S127000

Reexamination Certificate

active

07126216

ABSTRACT:
The invention provides a two part mold for forming wafer scale caps. The mold has a first half and a second half. The first half and second half, when brought together defining mold cavities for wafer scale caps. The caps have central areas surrounded by sidewalls and the side walls having free edges. In preferred embodiments, the mold is made from a semiconductor material.

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Derwent Abstract Acc No. 97-078741/08, DE 19628237A (Nippon Denso C/L) Jan. 16, 1997.
Derwent Abstract Acc No. 2001-150839/16, JP 2000277753A (Matsushita Electric Works)Oct. 6, 2000.

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