UFBGA package equipped with interface assembly including a photo

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257678, 257690, H01L 2348

Patent

active

058775498

ABSTRACT:
An improved UFBGA package equipped with an interface assembly having external electrode protrusions, an anisotropic conductive film, and a photosoluble film, which includes an interface assembly provided at the lower portion of the substrate.

REFERENCES:
patent: 4731282 (1988-03-01), Tsukagoshi et al.
patent: 5042919 (1991-08-01), Yabu et al.
patent: 5072289 (1991-12-01), Sugimoto et al.
patent: 5120665 (1992-06-01), Tsukagoshi et al.
patent: 5283468 (1994-02-01), Kondo et al.
patent: 5291062 (1994-03-01), Higgins, III
patent: 5302854 (1994-04-01), Nishigurhi et al.
patent: 5434452 (1995-07-01), Higgins, III
Nekkei Electronics Magazine, May 1994, pp. 42-45.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

UFBGA package equipped with interface assembly including a photo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with UFBGA package equipped with interface assembly including a photo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and UFBGA package equipped with interface assembly including a photo will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-425525

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.