Triazine thin film adhesives

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

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361750, 361751, 428209, 428901, 528 70, 528 98, B32B 300

Patent

active

053192443

ABSTRACT:
Disclosed are thin film triazine adhesives on organic carriers, method for making them and microelectronic circuit packages incorporating them. The circuit package has a substrate made up of organic, dielectric, polymeric sheets. At least one pair of the polymeric sheets face each other and are adhesively joined together by a triazine polymer.

REFERENCES:
patent: 4456712 (1984-06-01), Christie et al.
patent: 4636578 (1987-01-01), Feinberg
patent: 4725484 (1988-02-01), Kumagawa
patent: 4745215 (1988-05-01), Cox et al.
patent: 4782116 (1988-11-01), Holte
patent: 4954873 (1990-09-01), Lee et al.
patent: 5103293 (1992-04-01), Bonafino et al.
patent: 5135556 (1992-08-01), Hornback et al.
"Printed Circuit Board Packaging" D. P. Seraphim et al, 1988, pp. 334-371.
"Polymers & Polymer-Based Composites For Electronic Applications" G. P. Schmitt et al; 1988, pp. 853-922.

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