LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Board-on-chip type substrates with conductive traces in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Boat and assembly method for ball grid array packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Bond pad rerouting element, rerouted semiconductor devices...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Bondable anodized aluminum heatspreader for semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Bonded assembly having improved adhesive bond strength

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Bonded assembly having improved adhesive bond strength

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Bonding lead structure with enhanced encapsulation

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Bonding of silicon carbide chip with a semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Bonding pad sharing method applied to multi-chip module and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Bonding pad test configuration

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Bonding structure of dielectric substrates for impedance matchin

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Borderless contact structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Borderless contact structures

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Bottom heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Bottom lead semiconductor chip stack package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Bottom lead semiconductor package having folded leads

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Bow control in an electronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Bow control in an electronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Bridge connection type of chip package and fabricating...