Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1997-05-14
1999-08-17
Wallace, Valencia
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257673, 257723, 257686, H01L 2348
Patent
active
059397799
ABSTRACT:
A bottom lead semiconductor chip stack package which includes a first body and a second body. The first body includes a pair of lead frames, each lead frame having a first lead portion and a second lead portion. A protrusion enclosed in a solder extends from the first lead portion. The first body also includes a semiconductor chip containing chip pads disposed on the surface thereof, the chip pads being connected to the solder enclosed protrusions. The second body has substantially the same structural configurations as the first body and is reversely stacked relative to the first body such that the semiconductor chips are disposed in opposing relationship relative to each other. An adhesive attaches the lead frames of the first body to the corresponding lead frames of the second body.
REFERENCES:
patent: 3978516 (1976-08-01), Noe
patent: 5172214 (1992-12-01), Casto
patent: 5296737 (1994-03-01), Nishimura et al.
patent: 5331235 (1994-07-01), Chun
patent: 5407864 (1995-04-01), Kim
patent: 5428248 (1995-06-01), Cha
patent: 5479051 (1995-12-01), Waki et al.
patent: 5530292 (1996-06-01), Waki et al.
patent: 5633528 (1997-05-01), Abbott et al.
patent: 5677567 (1997-10-01), Ma et al.
Eckert II George C.
LG Semicon Co. Ltd.
Wallace Valencia
LandOfFree
Bottom lead semiconductor chip stack package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bottom lead semiconductor chip stack package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bottom lead semiconductor chip stack package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-317267