Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2008-05-13
2008-05-13
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C347S040000, C347S047000, C347S049000, C347S059000, C347S065000, C216S027000, C216S033000
Reexamination Certificate
active
07372145
ABSTRACT:
A bonded assembly is provided. The bonded assembly comprises: (a) a first substrate having a plurality of etched trenches defined in a first bonding surface; and (b) a second substrate having a second bonding surface. The second bonding surface is bonded to the first bonding surface with an adhesive and the adhesive is received, at least partially, in the plurality of etched trenches. Semiconductors chips bonded to a second substrate exemplify the advantages of the invention. The etched trenches allow the adhesive bond to be strengthened whilst avoiding increased surface roughening.
REFERENCES:
patent: 4929969 (1990-05-01), Morris
patent: 6127243 (2000-10-01), Werner et al.
patent: 6288451 (2001-09-01), Tsao
patent: 6406636 (2002-06-01), Vaganov
patent: 6410859 (2002-06-01), King
patent: 6433390 (2002-08-01), Hara
patent: 6435667 (2002-08-01), Silverbrook
patent: 6488366 (2002-12-01), Potochnik et al.
patent: 2002/0021336 (2002-02-01), Moon et al.
patent: 2003/0116276 (2003-06-01), Weldon et al.
patent: 2003/0209314 (2003-11-01), Guo et al.
patent: 2003/0211705 (2003-11-01), Tong et al.
patent: 2004/0011761 (2004-01-01), Dewa
patent: 2004/0092804 (2004-05-01), Rayssac
patent: 2004/0113280 (2004-06-01), Kim
patent: 2004/0224480 (2004-11-01), Forbes
patent: 2004/0239729 (2004-12-01), Kim et al.
patent: 2005/0029222 (2005-02-01), Chen
patent: 2005/0100727 (2005-05-01), Yokouchi et al.
patent: 2005/0140731 (2005-06-01), Silverbrook et al.
patent: 2005/0157107 (2005-07-01), Silverbrook et al.
patent: 2005/0162462 (2005-07-01), Silverbrook et al.
patent: 2006/0192810 (2006-08-01), Silverbrook
Chambliss Alonzo
Silverbrook Research Pty Ltd
LandOfFree
Bonded assembly having improved adhesive bond strength does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bonded assembly having improved adhesive bond strength, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonded assembly having improved adhesive bond strength will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2790486