Bonding pad sharing method applied to multi-chip module and...

Details Bonding pad sharing method applied to multi-chip module and... Bonding pad sharing method applied to multi-chip module and...

2011-04-12

2011-04-12

Tan, Vibol (Department: 2819)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S685000, C257S686000, C326S037000

Reexamination Certificate

active

07923829

ABSTRACT:
A multi-chip module (MCM) includes a first die and a second die. The first die supports a plurality of predetermined functions. The second die is coupled to the first die and comprises at least an option pad configured for a bonding option. The first die performs a predetermined function according to a bonding status of the option pad of the second die.

REFERENCES:
patent: 6034539 (2000-03-01), Hwang
patent: 6724237 (2004-04-01), Yamashita et al.
patent: 7075175 (2006-07-01), Kazi et al.

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