Bonding of silicon carbide chip with a semiconductor

Details Bonding of silicon carbide chip with a semiconductor Bonding of silicon carbide chip with a semiconductor

1998-03-23

1999-11-23

Dutton, Brian

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257712, 257 76, 257 77, H01L 310312

Patent

active

059905514

ABSTRACT:
A module and a method of making the module is disclosed. The module is fod from a semiconductor and a silicon carbide chip for high temperature applications. The module is designed to be compatible with current silicon IC processes.

REFERENCES:
patent: 4642864 (1987-02-01), Metcalfe et al.
patent: 5008735 (1991-04-01), Edmond et al.
patent: 5759908 (1998-06-01), Steckl et al.
patent: 5801442 (1998-09-01), Hamilton et al.
patent: 5877516 (1999-03-01), Mermagen et al.
patent: 5933750 (1999-08-01), Wilson et al.

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