Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2002-04-08
2008-09-09
Zarneke, David A (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE23021, C257SE23007, C257SE23008
Reexamination Certificate
active
07423336
ABSTRACT:
A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element is to be used. The conductive elements, which communicate with corresponding conductive vias, reroute the bond pad locations to corresponding contact pad locations adjacent to one peripheral edge or two adjacent peripheral edges of the rerouted semiconductor device. The rerouting element is particularly useful for rerouting centrally located bond pads of a semiconductor device, as well as for rerouting the peripheral locations of bond pads of a semiconductor device to one or two adjacent peripheral edges thereof. Methods for designing and using the rerouting element are also disclosed, as are semiconductor device assemblies including one or more rerouting elements.
REFERENCES:
patent: 4341594 (1982-07-01), Carlson et al.
patent: 4618878 (1986-10-01), Aoyama et al.
patent: 4803147 (1989-02-01), Mueller et al.
patent: 4948754 (1990-08-01), Kondo et al.
patent: 5049980 (1991-09-01), Saito et al.
patent: 5111279 (1992-05-01), Pasch
patent: 5168346 (1992-12-01), Pasch
patent: 5207887 (1993-05-01), Crumly et al.
patent: 5275973 (1994-01-01), Gelatos
patent: 5299730 (1994-04-01), Pasch et al.
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5347162 (1994-09-01), Pasch
patent: 5366906 (1994-11-01), Wojnarowski et al.
patent: 5384488 (1995-01-01), Golshan et al.
patent: 5410805 (1995-05-01), Pasch et al.
patent: 5468681 (1995-11-01), Pasch
patent: 5489804 (1996-02-01), Pasch
patent: 5504035 (1996-04-01), Rostoker et al.
patent: 5506756 (1996-04-01), Haley
patent: 5527741 (1996-06-01), Cole et al.
patent: 5554887 (1996-09-01), Sawai et al.
patent: 5565033 (1996-10-01), Gaynes et al.
patent: 5569963 (1996-10-01), Rostoker et al.
patent: 5658827 (1997-08-01), Aulicino et al.
patent: 5672912 (1997-09-01), Aoki et al.
patent: 5677576 (1997-10-01), Akagawa
patent: 5679977 (1997-10-01), Khandros et al.
patent: 5683942 (1997-11-01), Kata et al.
patent: 5770889 (1998-06-01), Rostoker et al.
patent: 5814894 (1998-09-01), Igarashi et al.
patent: 5821624 (1998-10-01), Pasch
patent: 5834799 (1998-11-01), Rostoker et al.
patent: 5834844 (1998-11-01), Akagawa et al.
patent: 5843798 (1998-12-01), Matsuda
patent: 5844304 (1998-12-01), Kata et al.
patent: 5851911 (1998-12-01), Farnworth
patent: 5886409 (1999-03-01), Ishino et al.
patent: 5886415 (1999-03-01), Akagawa
patent: 5907787 (1999-05-01), Sato
patent: 5925931 (1999-07-01), Yamamoto
patent: 5946555 (1999-08-01), Crumly et al.
patent: 5971253 (1999-10-01), Gilleo et al.
patent: 5977641 (1999-11-01), Takahashi et al.
patent: 6030889 (2000-02-01), Aulicino et al.
patent: 6043109 (2000-03-01), Yang et al.
patent: 6054761 (2000-04-01), McCormack et al.
patent: 6069071 (2000-05-01), Hasunuma et al.
patent: 6071810 (2000-06-01), Wada et al.
patent: 6072236 (2000-06-01), Akram et al.
patent: 6117539 (2000-09-01), Crotzer et al.
patent: 6132587 (2000-10-01), Jorne et al.
patent: 6165885 (2000-12-01), Gaynes et al.
patent: 6172569 (2001-01-01), McCall et al.
patent: 6179200 (2001-01-01), Kung et al.
patent: 6181569 (2001-01-01), Chakravorty
patent: 6211572 (2001-04-01), Fjelstad et al.
patent: 6212767 (2001-04-01), Tandy
patent: 6228687 (2001-05-01), Akram et al.
patent: 6233184 (2001-05-01), Barth et al.
patent: 6255737 (2001-07-01), Hashimoto
patent: 6284563 (2001-09-01), Fjelstad
patent: 6285203 (2001-09-01), Akram et al.
patent: 6294407 (2001-09-01), Jacobs
patent: 6306680 (2001-10-01), Fillion et al.
patent: 6319810 (2001-11-01), Ochiai et al.
patent: 6334249 (2002-01-01), Hsu
patent: 6343171 (2002-01-01), Yoshimura et al.
patent: 6348731 (2002-02-01), Ashley et al.
patent: 6376904 (2002-04-01), Haba et al.
patent: 6392306 (2002-05-01), Khandros et al.
patent: 6434017 (2002-08-01), Iwabuchi
patent: 6458231 (2002-10-01), Wapner et al.
patent: 6475896 (2002-11-01), Hashimoto
patent: 6492200 (2002-12-01), Park et al.
patent: 6515370 (2003-02-01), Hashimoto
patent: 6534853 (2003-03-01), Liu et al.
patent: 6573609 (2003-06-01), Fjelstad et al.
patent: 6590292 (2003-07-01), Barber et al.
patent: 2001/0006759 (2001-07-01), Shipley, Jr. et al.
patent: 2003/0038378 (2003-02-01), Jacobs
Vardaman, Jan, “What Does a CSP Cost?” Advanced Packaging's Guide to Emerging Technologies, Jul./Aug. 1997.
Brooks Jerry M.
Corisis David J.
Reynolds Tracy V.
Schwab Matt E.
Micro)n Technology, Inc.
TraskBritt
Zarneke David A
LandOfFree
Bond pad rerouting element, rerouted semiconductor devices... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bond pad rerouting element, rerouted semiconductor devices..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bond pad rerouting element, rerouted semiconductor devices... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3984013