Bow control in an electronic package

Details Bow control in an electronic package Bow control in an electronic package

2007-06-26

2007-06-26

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S697000, C257SE23149, C257SE23152

Reexamination Certificate

active

10931844

ABSTRACT:
A package including a package substrate, a die-substrate assembly including a substrate including a plurality of layers including a layer having a mesh to stiffen the substrate adapted to mount one or more dice, one or more dice mounted on the substrate and a molding compound to attach the substrate to the package substrate.

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