Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-06-26
2007-06-26
Huynh, Andy (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S697000, C257SE23149, C257SE23152
Reexamination Certificate
active
10931844
ABSTRACT:
A package including a package substrate, a die-substrate assembly including a substrate including a plurality of layers including a layer having a mesh to stiffen the substrate adapted to mount one or more dice, one or more dice mounted on the substrate and a molding compound to attach the substrate to the package substrate.
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Chai Lee Kian
Kuan Lee Choon
Huynh Andy
Micro)n Technology, Inc.
Nguyen Dao H.
Schwegman Lundberg Woessner & Kluth P.A.
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