Bottom lead semiconductor package having folded leads

Details Bottom lead semiconductor package having folded leads Bottom lead semiconductor package having folded leads

1997-06-17

1999-03-23

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257694, H01L 2348

Patent

active

058864040

ABSTRACT:
A bottom lead semiconductor package includes a plurality of outer leads, wherein an outer portion of each of the outer leads is downwardly bent, and inner leads extend from a corresponding one of the outer leads respectively and are bent at least once upwardly and folded over onto a corresponding upper surface of the outer leads. A semiconductor chip is attached to an upper surface of each of the inner leads by a nonconductive adhesive, and a plurality of conductive wires or bumps electrically couples the chip to the inner leads. A molding compound seals a portion of the package including the chip, the inner leads and the wires, but externally exposes a downwardly bent portion of each of the outer leads.

REFERENCES:
patent: 5428248 (1995-06-01), Cha
patent: 5616953 (1997-04-01), King et al.

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