LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Semiconductor package having thermal interface material (TIM)

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Semiconductor package having through holes for molding back...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Semiconductor package having two chips internally connected...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor package having ultra-thin thickness and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Semiconductor package having vertically mounted passive...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Semiconductor package including a semiconductor chip adhesively

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor package including die interposed between...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor package including flex circuit, interconnects and

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Semiconductor package including heat sink with layered conductiv

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Semiconductor package including leads and conductive posts...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor package including low temperature co-fired...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Semiconductor package including redistribution pattern and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Semiconductor package including second substrate and having...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Semiconductor package including stacked chips with aligned...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Semiconductor package including stacked semiconductor chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Semiconductor package including two semiconductor die...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor package integral with semiconductor chip

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor package integral with semiconductor chip

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor package land grid array substrate and...