Semiconductor package including flex circuit, interconnects and

Details Semiconductor package including flex circuit, interconnects and Semiconductor package including flex circuit, interconnects and

1997-10-31

2000-08-01

Potter, Roy

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257737, 257791, H01L 2304

Patent

active

060970871

ABSTRACT:
A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in electrical communication with the external contacts. The package also includes interconnects configured to provide separate electrical paths between die contacts (e.g., bond pads), and the conductors on the flex circuit. Several different embodiments of interconnects are provided including: bumps on the die contacts, bonded to the flex circuit conductors with a conductive adhesive layer; polymer bumps on the conductors, or die contacts, applied in a semi-cured state and then fully cured; solder bumps on the die contacts and conductors, bonded to one another using a bonding tool; rivet-like bonded connections between the conductors and die contacts, formed using metal bumps and a wire bonding or ball bonding apparatus; single point bonded connections between the conductors and die contacts, formed with a bonding tool; and wire bonds between the conductors and die contacts.

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