Semiconductor package including low temperature co-fired...

Details Semiconductor package including low temperature co-fired... Semiconductor package including low temperature co-fired...

2005-04-12

2005-04-12

Smith, Brad (Department: 2824)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S678000, C257S690000, C438S125000

Reexamination Certificate

active

06879034

ABSTRACT:
A semiconductor package comprising a low temperature co-fired ceramic substrate defining opposed top and bottom surfaces. The substrate comprises at least two stacked ceramic layers and electrically conductive patterns which extend between the layers and along the top surface of the substrate. Mounted to the top surface of the substrate and electrically connected to the conductive patterns is at least one semiconductor die. A plurality of leads extend at least partially about the substrate in spaced relation thereto. Each of the leads defines opposed top and bottom surfaces, the semiconductor die being electrically connected to at least one of the leads. A package body at least partially encapsulates the substrate, the semiconductor die and the leads such that at least a portion of the bottom surface of each of the leads is exposed in the package body.

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