Semiconductor package having through holes for molding back...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Reexamination Certificate

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C257S690000, C257S704000, C257S723000, C257S787000, C257SE23003, C257SE23078

Reexamination Certificate

active

07952179

ABSTRACT:
A portable memory card and methods of manufacturing same are disclosed. The portable memory includes a substrate having a plurality of holes formed therein. During the encapsulation process, mold compound flows over the top surface of the substrate, through the holes, and down into a recessed section formed in the bottom mold cap plate to form a projection of mold compound on the bottom surface of the substrate.

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