LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame including suspending leads having trenches formed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Lead frame type semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Lead frame with heat spreader and semiconductor package...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Lead frame, semiconductor device produced by using the same...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frames including inner-digitized bond fingers on bus...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead on chip lead frame design without jumpover wiring

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead on chip type semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead pin, circuit, semiconductor device, and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Lead structure for sealing package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Lead-bond type chip package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Lead-bond type chip package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Lead-frame having interdigitated signal and ground leads with hi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead-frame having unused input/output terminals separated from i

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Lead-frame method and assembly for interconnecting circuits...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead-frame-based semiconductor package and fabrication...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead-free integrated circuit package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Leaded package integrated circuit stacking

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Leaded semiconductor device having accessible power supply pad t

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Leaded substrate carrier for integrated circuit device and leade