Leaded package integrated circuit stacking

Details Leaded package integrated circuit stacking Leaded package integrated circuit stacking

2007-08-21

2007-08-21

Jackson, Jerome (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S690000, C257SE23060

Reexamination Certificate

active

11248662

ABSTRACT:
A system and method for electrically and thermally coupling adjacent IC packages to one another in a stacked configuration is provided. A flex circuit is inserted in part between ICs to be stacked and provides a connective field that provides plural contact areas that connect to respective leads of the ICs. Thus, the flex does not require discrete leads which must be individually aligned with the individual leads of the constituent ICs employed in the stack. The principle may be employed to aggregate two or more contact areas for respective connection to leads of constituent ICs but is most profitably employed with a continuous connective field that provides contact areas for many leads of the ICs.

REFERENCES:
patent: 6313998 (2001-11-01), Kledzik et al.
patent: 6572387 (2003-06-01), Burns et al.
patent: 6608763 (2003-08-01), Burns et al.
patent: 2006/0050592 (2006-03-01), Cady et al.

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