Lead-free integrated circuit package structure

Details Lead-free integrated circuit package structure Lead-free integrated circuit package structure

2007-02-20

2007-02-20

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257SE23004, C257SE23067, C257SE23068, C257SE23069, C257SE25013, C257S774000, C257S773000, C257S680000, C257S786000, C257S784000, C257S691000, C257S692000, C257S693000

Reexamination Certificate

active

11040334

ABSTRACT:
An integrated circuit package (60) has a substrate (12) with a first surface (51) for mounting a semiconductor die (20) and a second surface (52) defining a via (70). A lead (26) is formed by plating a conductive material to project outwardly from the second surface. The conductive material extends from the lead through the first via for coupling to the semiconductor die.

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