Lead-frame having interdigitated signal and ground leads with hi

Details Lead-frame having interdigitated signal and ground leads with hi Lead-frame having interdigitated signal and ground leads with hi

1997-04-25

1999-02-09

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

257692, 257696, 257698, 257666, 257691, H01L 23495, H01L 2702, H01L 2348

Patent

active

058698981

ABSTRACT:
A lead-frame is sealed in a full-mold insulating package together with a semiconductor chip; the lead-frame has a conductive die pad for mounting the semiconductor chip, first conductive leads integral with the conductive die pad and electrically connected through conductive wires to bonding pads of the semiconductor chip so as to supply a ground potential to the semiconductor chip and second conductive leads separated from the conductive die pad so as to supply high-frequency input signals through conductive wires to other bonding pads, and the second conductive leads are respectively located between the first conductive leads and other first conductive leads closest to the corners of the full-mold package so that a good electrical isolation is provided between the second conductive leads.

REFERENCES:
patent: 4506285 (1985-03-01), Einzinger
patent: 5223740 (1993-06-01), Ishikawa et al.
patent: 5229846 (1993-07-01), Kozuka
patent: 5276352 (1994-01-01), Komenaka et al.
patent: 5393705 (1995-02-01), Sonobe
patent: 5594234 (1997-01-01), Carter, Jr. et al.
patent: 5648682 (1997-07-01), Nakazawa et al.

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