Leaded substrate carrier for integrated circuit device and leade

Details Leaded substrate carrier for integrated circuit device and leade Leaded substrate carrier for integrated circuit device and leade

1997-07-03

1999-08-24

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257691, 257693, 257696, 257735, 257736, 257701, H01L 2348, H01L 2352

Patent

active

059427957

ABSTRACT:
Leaded substrates carriers and packaged integrated circuit devices that utilize such carriers as well as method of manufacturing the same are disclosed. The substrate carrier comprises a series of conductor lines for electrically connecting the active side of the chip to leads formed as part of the substrate carrier and extending from the side of the substrate carrier. The leads extend beyond the sides of the substrate carrier and have planar metal surfaces designed to allow surface mounting and testing of the assembly.

REFERENCES:
patent: 5710459 (1998-01-01), Teng et al.
patent: 5736781 (1998-04-01), Atsumi
patent: 5773882 (1998-06-01), Iwasaki
patent: 5777387 (1998-07-01), Yamashita et al.
patent: 5789810 (1998-08-01), Gross et al.
patent: 5854512 (1998-12-01), Manteghi

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