Lead frame having supporters and semiconductor package using sam

Details Lead frame having supporters and semiconductor package using sam Lead frame having supporters and semiconductor package using sam

1997-01-17

2000-07-25

Whitehead, Jr, Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257666, 257667, 257668, 257669, 257687, 257674, 257676, H01L 23495, H01L 2322

Patent

active

060939591

ABSTRACT:
A lead frame and a semiconductor chip package includes supporters on a lead frame paddle and tiebars using the same for preventing undesired paddle bending which may occur due to the pressure of an epoxy molding compound during the molding process. The supports also allow improved heat dissipation during the molding process of the semiconductor chip package and mounting process of the package onto a printed circuit board.

REFERENCES:
patent: 5250839 (1993-10-01), Katoh et al.
patent: 5623163 (1997-04-01), Izumi
patent: 5789806 (1998-08-01), Chua et al.

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