Lead-frame method and assembly for interconnecting circuits...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Reexamination Certificate

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C257S698000

Reexamination Certificate

active

06900527

ABSTRACT:
A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.

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