Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate
2005-05-31
2005-05-31
Pert, Evan (Department: 2829)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
C257S698000
Reexamination Certificate
active
06900527
ABSTRACT:
A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.
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Bertholio Frédéric
Foster Donald Craig
Hoffman Paul Robert
Kaskoun Kenneth
Liebhard Markus
Amkor Technology Inc.
Pert Evan
Stetina Brunda Garred & Brucker
LandOfFree
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