Lead on chip lead frame design without jumpover wiring

Details Lead on chip lead frame design without jumpover wiring Lead on chip lead frame design without jumpover wiring

1996-10-09

1998-05-12

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257666, 257692, 257776, 257784, H01L 2352, H01L 23495

Patent

active

057510571

ABSTRACT:
Lead On Chip ("LOC") leadframe designs for thin, small-outline packages having improved configurations of leadframe members are provided. The LOC leadframes comprise a bus bar, having at least one distribution finger, and a plurality of lead fingers arranged in such a manner that jump-over is eliminated, thus increasing the reliability of the package.

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