Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-11-06
2007-11-06
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S666000, C257S685000, C257S723000, C257S788000, C257S790000, C438S109000, C438S111000, C438S123000, C438S125000
Reexamination Certificate
active
09923394
ABSTRACT:
A lead frame of the present invention includes a plurality of tie bars including tie bars each having deformable portions that protect opposite outside frames from deformation. The outside frames each are formed with positioning holes. Element loading portions to be loaded with semiconductor elements are connected to the outside frames by such tie bars. The lead frame is therefore free from deformation during lead forming while promoting the miniaturization of the semiconductor devices.
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Hirasawa Koki
Kimura Hiroyuki
Erdem Fazli
NEC Electronics Corporation
Pert Evan
Young & Thompson
LandOfFree
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